| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation displaced semiconductor device wherein a melted welding area does not drop aside a caulking part when a gate pipe is erected and the welding area of a gate lead wire is melted. SOLUTION: The vicinity of the tip of a gate pipe 8b is deformed when it is pressurized by a caulking blade, and a caulking part 83b is formed. Namely, the gate pipe 8b is fixed (insulation-displaced by caulking) at a gate lead wire 8a in the caulking part 83b around its tip. The length of the caulking part 83b is generally about 5 mm. The caulking part 83b is like a column having a uniform thickness from its root up to outermost end, and the end face 833b of the outermost end has a flat face forming about 45°to the center line of the column. Namely, the end face 833b thereof is made recessed. The gate lead wire 8a is projected as a welding area at about 2-3 mm from the end face 833b, and the welding area is welded. COPYRIGHT: (C)2005,JPO&NCIPI
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