发明名称 DIAMOND WORKING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To efficiently and precisely grind the whole cut surfaces of diamond, by using a numerically controlled machine. SOLUTION: A girdle 3 is ground by a grinding wheel 18 while rotating a work holding shaft 54 by coaxially holding the diamond 100 with a table 4 as a reference between a work shaft 14 and a tail stock spindle 30, by using a first processing apparatus 10 having the work shaft 14 and the tail stock shaft 14, by setting the table 4 of the roughly processed diamond 100 as a temporary reference surface of processing. Afterwards, the diamond 100 is held by the work holding shaft 58 so that its rotational symmetry axis becomes coaxial, by using a second processing apparatus 50 having an indexing means 62 on the work holding shaft 58. The table 4 is finally finished by grinding the cut surface by a grinding wheel 83, while indexing the respective cut surfaces of a pavilion 2 and a crown 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005125442(A) 申请公布日期 2005.05.19
申请号 JP20030362451 申请日期 2003.10.22
申请人 TOSHIBA MACH CO LTD;HOHOEMI BRAINS INC 发明人 TANAKA TATSUICHI;KAWABUCHI YOSHINORI
分类号 B24B9/16;(IPC1-7):B24B9/16 主分类号 B24B9/16
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