| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free high-temperature solder, whose joining strength and reliability are improved in comparison with those of conventional solder. SOLUTION: The high-temperature solder is an alloy having a base composition containing Sn and two or more of Cu, Al, and Ag in amounts of 0.1 wt% or more, specifically, 0-10 wt% Cu, 0-10 wt% Al, and 0-10 wt% Ag. The solder has specific gravity smaller than conventional Pb-Sn solder, and is excellent in joining strength and reliability. COPYRIGHT: (C)2005,JPO&NCIPI
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