| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramic joining substrate capable of improving reliability on a heat cycle and a manufacturing method for the substrate. SOLUTION: In the metal-ceramic joining substrate 10 in which a metal plate 14 for a circuit is joined on one surface of a ceramic board 12 while a metallic base plate 16 for dissipating heat is joined on the other surface, at least a part of the ceramic board 12 is buried in the metallic base plate 16. When the part of the ceramic board 12 is buried in the metallic base plate 16, the ceramic board 12 is arranged in approximately parallel with the metallic base plate 16. When all sections of the ceramic board 12 are buried in the metallic base plate 16, the ceramic board 12 is arranged in approximately parallel with the metallic base plate 16. COPYRIGHT: (C)2005,JPO&NCIPI |
