| 摘要 |
PROBLEM TO BE SOLVED: To shorten TAT in the production line of a semiconductor device. SOLUTION: Unit processing devices used in a die bonding, a curing/baking, a wire bonding, a resin molding, and a mold baking process respectively are arranged in compact regions, a plurality of unit processing processes are monitored by one or a few operators, works of a previously managed lot unit (60 LF) are subjected to processing by the lot unit (10 LF) smaller than the former lot unit (60 LF), a small number of the works of the same lot are subjected to simultaneous parallel processing in a curing/baking process or a wire bonding process using a plurality of unit processing devices, and a small number of the works are subjected to simultaneous parallel processing in a plurality of processes, whereby TAT can be shortened in the production line. COPYRIGHT: (C)2005,JPO&NCIPI
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