发明名称 CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To enable a circuit device surface-mounted with a chip or the like to be constituted without using a printed board. SOLUTION: A metal conductive member 31 is formed into a predetermined shape by press working and separated into one or more plate-like terminals 26, solder paste is printed on the masked terminals 26, and surface-mounting chips 28 are bonded and collectively reflow-soldered. The terminal 26 is inserted into an insulator 27 by insert molding, so that a switching circuit device can be constituted without using the printed board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005129639(A) 申请公布日期 2005.05.19
申请号 JP20030362040 申请日期 2003.10.22
申请人 TOKAI RIKA CO LTD 发明人 OSHIMA TAKAHIRO;SAEKI HITOSHI;TOYODA HIROYUKI
分类号 H05K3/34;H01H11/00;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/34
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