发明名称 PARTICLE FOR NON-LEADED JOINING
摘要 PROBLEM TO BE SOLVED: To provide joining particles superior in sphericity and using a lead-free solder material that is used for welding of an electrically conductive substance such as a metallic material. SOLUTION: The non-leaded joining particles are alloy joining particles essentially having lead content of 0.1 wt% or below. Assuming that one point on the surface of the joining particles is a first pole and that a point where a normal extending vertically to a virtual plane in contact with the joining particles in the first pole intersects the surface of the joining particles is a second pole, the non-leaded joining particles are characterized in that all angles formed by the plurality of beveled grain boundaries with the adjacent similar boundary are not in excess of 45°(0.25πradian), in the cross section in which the joining particles are cut with an arbitrary plane including the first and second poles. Such joining particles can be manufactured by melting the solder joining material, pulverizing it, and quenching it in a liquid cooling medium. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005125328(A) 申请公布日期 2005.05.19
申请号 JP20030349149 申请日期 2003.10.08
申请人 TOSHIBA CORP 发明人 TADAUCHI KIMIHIRO;KOMATSU IZURU;MATSUMOTO KAZUTAKA;SUZUKI ISAO;IMAMURA HIROKO;OUSE MICHIHIRO;YOSHIKI MASAHIKO;YABUKI MOTOO
分类号 B23K35/40;B23K35/26;C22C13/00;(IPC1-7):B23K35/40 主分类号 B23K35/40
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