| 摘要 |
The present invention provides a semiconductor device which comprises a die pad section ( 200 ) having a surface ( 201 ) and a back surface ( 202 ), a first semiconductor chip ( 4 ) having a surface ( 41 ) on which a first electrode section ( 47 ) is formed, and a back surface ( 42 ) fixed to the surface of the die pad section ( 200 ), a second semiconductor chip ( 5 ) having a surface ( 51 ) on which a second electrode section ( 57 ) is formed, and a back surface ( 52 ) fixed to the surface ( 41 ) of the first semiconductor chip ( 4 ), lead terminal sections ( 210 and 220 ) respectively electrically connected to the first and second electrode sections ( 47 and 57 ), and a resin encapsulating body ( 10 ) that seals the die pad section ( 200 ) and the first and second semiconductor chips ( 4 and 5 ). An edge portion ( 54 ) of the second semiconductor chip ( 5 ) protrudes from an edge portion ( 44 ) of the first semiconductor chip ( 4 ). An edge portion ( 204 ) of the die pad section ( 200 ) protrudes from an edge portion ( 44 ) of the first semiconductor chip ( 4 ).
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