| 摘要 |
The invention, in a specific embodiment, relates to a method and to a device for treating substrates ( 29 ) in printed circuit industry by means of a liquid. The invention is characterized in that the substrates ( 29 ), on their surface, are provided with a layer that is partially removed under the influence of the liquid while a pattern is formed. A plurality of nozzles ( 24 ) are provided for discharging the liquid and are linked with at least one liquid connection ( 12 ). Said liquid connection ( 12 ) is linked with a liquid reservoir and can be opened and closed. A valve ( 17 ) is provided directly on every nozzle ( 24 ), said valves ( 17 ) being individually controlled to open and close. The objects ( 29 ) are displaced along a track of movement (B) relative to the nozzles ( 24 ). A specific amount of liquid is discharged by opening and closing the valves ( 17 ) or the liquid connections ( 12 ) and has a certain distribution across the surface ( 26 ).
|
