发明名称 TAILORED TEMPERATURE UNIFORMITY
摘要 <p>Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.</p>
申请公布号 WO2005045905(A1) 申请公布日期 2005.05.19
申请号 WO2004US34811 申请日期 2004.10.20
申请人 APPLIED MATERIALS, INC.;RAMACHANDRAN, BALASUBRAMANIAN;RANISH, JOSEPH, M.;JALLEPALLY, RAVI;RAMAMURTHY, SUNDAR;ACHUTHARAMAN, RAMAN;HAAS, BRIAN;HUNTER, AARON 发明人 RAMACHANDRAN, BALASUBRAMANIAN;RANISH, JOSEPH, M.;JALLEPALLY, RAVI;RAMAMURTHY, SUNDAR;ACHUTHARAMAN, RAMAN;HAAS, BRIAN;HUNTER, AARON
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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