SEMICONDUCTOR COMPONENT HAVING A CSP HOUSING

摘要

The invention relates to a semiconductor component for mounting on a printed circuit board. The semiconductor component includes a housing that at least partially surrounds at least one flat semiconductor chip. Electrical contacts are assigned to the semiconductor chip and serve to establish an electrical connection to electrodes provided on a printed circuit board. The flat semiconductor chip has a mounting lateral surface that includes contact surfaces configured to make contact with the electrical contacts. A buffer layer is located between the housing and the chip, and surrounds the chip up to a supporting surface located on the mounting lateral surface.