Semiconductor package insulation film and manufacturing method thereof

摘要

An insulation film for providing an insulation substrate carrying a semiconductor chip of a semiconductor package. Insulation film 10 is provided with rows of opposing sprocket holes 12 formed on either edge of the above mentioned insulation film, and through holes 14 are disposed two-dimensionally between the rows of sprocket holes 12 . Pitch p between through holes 14 is determined by the relationship mp=nL (i.e., n and m are integers, and n<m), wherein pitch of the sprocket holes is taken to be L. Through holes 14 are selectively utilized during formation of the desired circuit pattern upon insulation film 10 according to size of the manufactured semiconductor package.