发明名称 Gimbal assembly for semiconductor fabrication and other tools
摘要 A gimbal assembly that can be used in conjunction with semiconductor fabrication tools, such as chemical-mechanical polishing (CMP) tools, as well as other types of tools, is disclosed. A gimbal assembly may include a gimbal hub, a pivot head plate, a gimbal sleeve, and a gimbal post. The gimbal hub has an interior cavity. The pivot head plate has a ball head, a base, and an outer edge, where the base is situated in the bottom of the interior cavity. The gimbal sleeve is situated in the bottom of the interior cavity over the outer edge of the pivot head plate, securing the pivot head plate in place within the interior cavity. The gimbal post is situated over the ball head of the pivot head plate. The ball head of the pivot head plate preferably has dual diameters.
申请公布号 US6893331(B2) 申请公布日期 2005.05.17
申请号 US20020143622 申请日期 2002.05.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD 发明人 HUANG WEN-JUNG;CHANG CHIN HAO;CHEN JAF
分类号 B24B37/04;B24B41/04;(IPC1-7):B24B29/00 主分类号 B24B37/04
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