发明名称 Substrate processing apparatus and substrate processing method
摘要 A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.
申请公布号 US6893805(B2) 申请公布日期 2005.05.17
申请号 US20020256120 申请日期 2002.09.25
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 ISEKI IZURU;UEYAMA TSUTOMU
分类号 G03F7/16;B05C9/12;G03F7/38;H01L21/00;H01L21/027;H01L21/31;H01L21/3105;H01L21/677;H01L21/768;(IPC1-7):H01L21/31 主分类号 G03F7/16
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