发明名称 Heat sink with heat pipe and base fins
摘要 A heat sink includes at least one heat pipe attached to a base having a substantially flat region for interfacing with an electronic component. Additionally, the heat sink comprises fins attached to the base and at least one heat pipe. The fins and the base may be integral with or attached to each other. Such a heat sink can dissipate heat from one or more electronic components more efficiently as the heat pipe coupled with the fins attached to the base provide alternate heat transfer paths for heat generated by electronic components.
申请公布号 US6894900(B2) 申请公布日期 2005.05.17
申请号 US20020246322 申请日期 2002.09.17
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 MALONE CHRISTOPHER G.
分类号 F28D15/02;F28F1/32;F28F3/02;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28D15/02
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