| 摘要 |
A method to effectively deposit multi-component solders while remaining compatible with electroplating solder bumping process. A flip-chip solder bump is formed by using electroplated solder bump technology with the addition of wettable layer of metal or solder. The remainder of the required solder volume is deposited by Injection Molded Solder (IMS) technology. This method will accommodate certain metals, as well as trace amounts of alloying, that would be difficult or impossible to electroplate. The method also allows for electrical test between deposition of the wettable layer of solder and the bulk solder, providing the advantages of a more planar surface for probe contact, with very consistent height, less solder pick-up by the test probe and elimination of the post-probe solder reflow step.
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