发明名称 |
Cleaning apparatus for ECMD anode pad |
摘要 |
A cleaning apparatus for an ECMD anode pad including a vacuum head which applies vacuum pressure to the surface of the anode pad between ECMD operations in order to remove particles precipitated onto the surface of the anode pad and prevent or minimize inadvertent scratching or peeling of a wafer supported by the pad during the process. The particles are dislodged from the anode pad and removed from the ECMD system by flow of electrolyte solution into the vacuum head. The electrolyte solution is typically filtered before returning to the electrolyte tank for ultimate redistribution to the ECMD system.
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申请公布号 |
US6893549(B2) |
申请公布日期 |
2005.05.17 |
申请号 |
US20020266045 |
申请日期 |
2002.10.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
CHOU SHIH-WEI;TSAI MINGHSNG |
分类号 |
B08B5/04;C25D5/22;C25D17/14;(IPC1-7):C25D5/48;A47L7/00 |
主分类号 |
B08B5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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