发明名称 Layered resin molding and multilayered molded article
摘要 The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.
申请公布号 US6893729(B2) 申请公布日期 2005.05.17
申请号 US20020203967 申请日期 2002.11.01
申请人 DAIKIN INDUSTRIES, LTD. 发明人 INABA TAKESHI;KATO TAKETO;SAGISAKA SHIGEHITO;ARASE TAKUYA;SHIMIZU TETSUO
分类号 B32B27/08;(IPC1-7):B32B27/08;B32B27/30;C08L77/00 主分类号 B32B27/08
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