发明名称 Method of manufacturing metal-oxide-semiconductor transistor
摘要 A method of manufacturing a MOS transistor is provided. A gate insulation layer and a conductive layer are sequentially formed over a substrate. A pre-amorphization implantation is carried out to amorphize the conductive layer. The conductive layer and the gate insulation layer are patterned to form a gate structure. A first spacer is formed on the sidewall of the gate structure. A second pre-amorphization implantation is carried out to amorphize a portion of the substrate. A doped source/drain extension region is formed in the substrate on each side of the first spacer. A second spacer is formed on the sidewall of the first spacer and then a doped source/drain region is formed in the substrate on each side of the second spacer. A solid phase epitaxial process is carried out to convert the doped source/drain extension region and the doped source/drain region into a source/drain terminal. In the pre-amorphization implantations, dopants having an ionic radius greater than the germanium ion are used.
申请公布号 US6893909(B2) 申请公布日期 2005.05.17
申请号 US20030681768 申请日期 2003.10.07
申请人 UNITED MICROELECTRONICS CORP. 发明人 WANG YU-REN;LEE CHUN-YI;CHEN YU-KUN;YANG NENG-HUI
分类号 H01L21/00;H01L21/265;H01L21/28;H01L21/336;H01L29/78;(IPC1-7):H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址