发明名称 Thermal control apparatus for electronic systems
摘要 A thermal control apparatus using heat pipes. The thermal control apparatus includes a heat pipe having a hollow interior at least partially filled with a vaporizable liquid. The heat pipe further includes a threaded outer surface configured for coupling the heat pipe into an aperture having a threaded inner surface. The threaded outer surface maybe an integral portion of the heat pipe, or may be implemented using a separate piece that coupled to the heat pipe. A thermal control apparatus using the heat pipes may be implemented with a heat spreader having one or more apertures, wherein each of the apertures includes a threaded inner surface. A heat pipe having a threaded outer surface may be positioned in one of the apertures. The thermal control apparatus may be mounted on a printed circuit board in the proximity of one or more electronic components.
申请公布号 US6892801(B1) 申请公布日期 2005.05.17
申请号 US20040757930 申请日期 2004.01.15
申请人 SUN MICROSYSTEMS, INC. 发明人 KIM DAVID K. J.
分类号 F28D15/02;H01L23/427;H01L23/433;(IPC1-7):F28D15/00 主分类号 F28D15/02
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