| 摘要 |
A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2 a to 2 c, two copper plates 3 a and 3 b, two lead plates 4 a and 4 b, a supply tube 5, a discharge tube 6, four insulating members 7 a to 7 d, and three heat sinks 10 a to 10 c. Here, the heat sink 10 a to 10 c is formed by a lower planar member 12 formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together. The heat sink 10 a to 10 c is provided with pillar pieces 24 for connecting the bottom face of supply water path groove portion 22 and the lower face of intermediate planar member 14 to each other, and pillar pieces 32 for connecting the bottom face of discharge water path groove portion 30 and the upper face of intermediate planar member 14 to each other.
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