发明名称 |
Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit |
摘要 |
Thin film circuit elements including capacitors, resistors, and inductance elements are formed on a large substrate, and semiconductor chips are wire bonded to the substrate. The elements and chips are sealed by potting a sealing resin. The large substrate is divided into multiple stripe substrates by dicing and a thin-film conductive layer is sputtered on cut surfaces of the stripe substrates, thereby electrically connecting edges of lower conductive patterns to edges of upper conductive patterns exposed from side surfaces of the sealing resin through the thin-film conductive layer. A Ni foundation layer and Au layer are successively plated on a surface of the thin-film conductive layer to form edge electrodes on side surfaces of the stripe substrates and the stripe substrates are divided finely into individual alumina substrates.
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申请公布号 |
US6894373(B2) |
申请公布日期 |
2005.05.17 |
申请号 |
US20030440922 |
申请日期 |
2003.05.19 |
申请人 |
ALPS ELECTRIC CO., LTD. |
发明人 |
UEDA KAZUHIKO;YOKOYAMA SEIICHI |
分类号 |
H01L23/12;H01L23/13;H01L23/498;H01L25/04;H01L25/16;H01L25/18;H01L27/06;H05K1/03;H05K1/16;H05K3/24;H05K3/40;(IPC1-7):H01L23/02;H01L23/15;H01L23/053;H01L23/051;H01L23/043 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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