发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device for controlling cooling rate of a semiconductor device melted by laser irradiation and enlarging scale of a grown crystal, and to provide its manufacturing method. SOLUTION: In the semiconductor device 1, a first base film 3, a second base film 4 and a semiconductor film 5 are stacked in this order on a substrate 2. It is characterized that thermal conductivity of the first base film 3 is higher than those of the substrate 2 and the second base film 4. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123262(A) 申请公布日期 2005.05.12
申请号 JP20030353791 申请日期 2003.10.14
申请人 SHARP CORP 发明人 OKAZAKI SHINYA;NAKAYAMA JUNICHIRO
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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