发明名称 Integrated liquid cooling system for electronic components
摘要 A liquid cooling system includes a container ( 10 ) defining communicable first and second chambers ( 125 a, 125 b) therein, a pump ( 15 ) mounted on the container and having an entrance port ( 152 ) in flow communication with the second chamber, and an exit port ( 150 ) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit ( 2 ) located at the loop for cooling the coolant.
申请公布号 US2005098305(A1) 申请公布日期 2005.05.12
申请号 US20040946702 申请日期 2004.09.21
申请人 LEE HSIEH KUN;LAI CHENG-TIEN;ZHOU SHI-WEN 发明人 LEE HSIEH KUN;LAI CHENG-TIEN;ZHOU SHI-WEN
分类号 H01L23/473;(IPC1-7):F28D15/00 主分类号 H01L23/473
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