| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device for preventing air bubbles from being brought therearound and resin from being cracked by exposing the head top of a protruded electrode without performing an exposing processing for the tip end of the protruded electrode after resin sealing. SOLUTION: A protruded electrode (2) is formed on the first principal surface of a semiconductor wafer (1) on which a plurality of semiconductor elements are formed, and a metal plate (5) is formed on the second principal surface of the semiconductor wafer over the whole of the same. The semiconductor wafer (1) is diced into the individual semiconductor elements leaving the metal plate (5) behind and taking a side of the first principal surface of the semiconductor wafer (1) as a cut area, and the semiconductor wafer (1) is mounted in a pair of upper and lower metal molds (6, 6). Molding resin (10) is injected from any one of the upper or lower metal molds while holding the semiconductor wafer in the metal molds with pressure. Further, the semiconductor wafer is resin molded, and molded resin is hardened to dice the semiconductor wafer to the individual semiconductor elements. COPYRIGHT: (C)2005,JPO&NCIPI |
