| 摘要 |
The present invention provides an aqueous composition useful for polishing a semiconductor wafer, the wafer comprising a tantalum barrier material in the presence of a dielectric and an interconnect metal. The composition comprises an azole compound having a concentration sufficient to accelerate removal of the tantalum barrier material. In addition, the azole compound does not inhibit removal of the interconnect metal. The composition further comprises an abrasive. Also, the composition has a greater selectivity of the tantalum barrier material relative to the dielectric.
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