METHOD FOR BONDING THERMOPLASTICS

摘要

A method for bonding thermoplastic substrates is provided. A thin, porous, resistive heater is provided between layers of thermoplastic substrates to b e bonded in the absence of an adhesive. The fabric heater is in intimate conta ct with the substrates at the joint by application of pressure. When the heater is energized, the thermoplastic material at the joint is melted or softened, and becomes uniformly distributed in the weld. After cooling, the fabric heater remains within the weld area and provides increased reinforcement to the weld bond.