摘要 |
This invention includes chemical vapor deposition apparatus, methods of chemical vapor depositing an amorphous carbon comprising layer on a substrate, and methods of chemical vapor depositing at least one of Si<SUB>3</SUB>N<SUB>4 </SUB>and Si<SUB>x</SUB>O<SUB>y</SUB>N<SUB>z </SUB>on a substrate. In certain implementations, a gas output manifold having at least one gas output to a deposition chamber and at least three gas inputs is utilized. In certain implementations, a remote plasma generator is utilized. In certain implementations, at least one cleaning gas input line feeds the remote plasma generator. In certain implementations, the at least one cleaning gas input line includes an amorphous carbon cleaning gas input and an Si<SUB>3</SUB>N<SUB>4 </SUB>or Si<SUB>x</SUB>O<SUB>y</SUB>N<SUB>z </SUB>cleaning gas input.
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