METHOD FOR PRODUCING RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND METHOD FOR FINELY GRINDING COLORING AGENT THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing, in which crude aggregate of carbon black is finely ground in order to reduce occurrence of electric defect of a semiconductor package caused by crude aggregate of carbon black, scarcely causing electric failure. SOLUTION: A method for finely grinding a coloring agent used for resin composition for semiconductor sealing comprises finely grinding the coloring agent by a grinder. A method for producing a resin composition having resin for semiconductor sealing and the coloring agent comprises a process for finely grinding the coloring agent by the grinder. COPYRIGHT: (C)2005,JPO&NCIPI