发明名称 |
METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated electronic component by which the problem caused by a cutting step performed in a ceramic laminate separating step is dissolved by abolishing the cutting step in the manufacturing process of a laminated electronic component. SOLUTION: A vanishing layer vanishes when a prescribed process is performed, and is formed in advance in each sheet so that the vanishing layers may continue and pass through a laminate from the top surface to the bottom surface when the sheets are laminated upon another. The laminate is separated by performing the prescribed process on the laminate in this state. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005123507(A) |
申请公布日期 |
2005.05.12 |
申请号 |
JP20030359115 |
申请日期 |
2003.10.20 |
申请人 |
TDK CORP |
发明人 |
YOSHIDA MASAYUKI;SUDO JUNICHI;AOKI SHUNJI;WATANABE GENICHI |
分类号 |
H01G4/12;H01G4/30;(IPC1-7):H01G4/30 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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地址 |
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