发明名称 METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated electronic component by which the problem caused by a cutting step performed in a ceramic laminate separating step is dissolved by abolishing the cutting step in the manufacturing process of a laminated electronic component. SOLUTION: A vanishing layer vanishes when a prescribed process is performed, and is formed in advance in each sheet so that the vanishing layers may continue and pass through a laminate from the top surface to the bottom surface when the sheets are laminated upon another. The laminate is separated by performing the prescribed process on the laminate in this state. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123507(A) 申请公布日期 2005.05.12
申请号 JP20030359115 申请日期 2003.10.20
申请人 TDK CORP 发明人 YOSHIDA MASAYUKI;SUDO JUNICHI;AOKI SHUNJI;WATANABE GENICHI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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