发明名称 METHOD OF FORMING APPLICATION FILM AND APPLICATION FILM FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To form an application film on a substrate and appropriately measure a thickness of the film according to material of the substrate and the application film itself. SOLUTION: An application film M3 is formed on a top surface of a substrate S as the substrate S is moved to the left while discharging a sheet-like resin M2 from a die 140. The die 140 is movable upwardly and downwardly to a support member 113. A laser displacement gauge 151 mounted on the support member 113 measures a distance D to an object below it. Before forming the application film M3, distances to positions P1, P2, tec. on the top surface of the substrate S are measured as the substrate S is moved to the left when the resin M2 is not discharged. The height from the top surface of the substrate S is obtained by smoothing the measured distances. After forming the application film M3, distances to positions Q1, Q2, etc. on the surface of the application film M3 as the die 140 is moved upwardly or downwardly according to the obtained height. The height from the surface of the application film M3 is obtained by smoothing the measured distances. The thickness of the film is obtained from the difference of the both heights. The degrees of the individual smoothing processes are determined independently. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123015(A) 申请公布日期 2005.05.12
申请号 JP20030356212 申请日期 2003.10.16
申请人 DAINIPPON PRINTING CO LTD 发明人 HATA NAOKI;HAYASHI KENTA;SOEDA MASAHIKO
分类号 G01B21/08;B05C5/00;H01J9/02;H01J9/42;H01J11/22;H01J11/34;H01J11/36;(IPC1-7):H01J9/02;H01J11/02 主分类号 G01B21/08
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