| 摘要 |
A semiconductor optical package for optical communication includes a cooling plate dissipating internal heat generated from the semiconductor optical package and having one or more grooves passing through top and bottom surfaces thereof. There is a housing having one or more slots formed on its bottom face, the housing at least partly enclosing an optical transmission module resting on the cooling plate such that the respective slots thereof correspond to the respective grooves of the cooling plate. There are also one or more screws passing through the grooves and inserted into the slots for coupling the housing to the optical transmission module.
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