| 摘要 |
A method for configuring an electronic unit having a plurality of sides for conductive cooling is described. The electronic unit is configured to be mounted in a mounting rack and the method comprises attaching a heat conduction mechanism including an expandable heat transferring structure to the electronic unit. The heat conduction mechanism is expandable to contact a surface of the mounting rack upon activation, thereby conductively transferring heat from the electronic unit to the mounting rack.
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