| 摘要 |
A multiple chips image sensor module includes a first substrate; a photosensitive chip is arranged at the upper surface of the substrate; a lens holder is mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel is arranged within the lens holder and is formed with a chamber and an opening communicating the chamber; an aspheric and transparent layer placed within the chamber; a second substrate is mounted on the first substrate and is electrically connected the first substrate; and a chip located on the second surface of the second substrate.
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