| 摘要 |
A method and apparatus for using light emitting diodes, LEDs, (10) for curing materials (e.g. adhesives, dental resins). The invention includes a method for cooling the light emitting diodes (10) with a coolant gas or liquid (21) and mounting the light emitting diodes (10) on a heat pipe (64) in a manner which delivers ultra high power in ultraviolet (UV), visible and infrared (IR) regions. The unique LED packaging technology performs far more efficiently in much more compact space allowing for closely spaced LEDs (10) operating at higher power and brightness. |
