发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide such a structure that can prevent a leakage among wires through a carbon containing in a sealing resin, and provide a structure of an electromagnetic shield that can prevent discharging and entry of electromagnetic waves from a semiconductor device or a wire and to the outside. <P>SOLUTION: A dummy wire 10 is provided outside so as to cover a wire 3 entirely at a narrower pitch and much more than the wire 3. Due to such a structure, even if carbon particles exist, the carbon particles larger in size than an interval between the dummy wires 10 is impossible to enter the inside, generating no leakage between the wires 3. In addition, the carbon particles smaller in size than an interval between the dummy wires 10 are possible to enter the inside, however, they are smaller than an interval between the wires 3, resulting in no leakage between the wires 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123379(A) 申请公布日期 2005.05.12
申请号 JP20030356223 申请日期 2003.10.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMOTO KATSUYOSHI;YOSHIDA TAKAYUKI;MATSUMURA KAZUHIKO;KAINO NORIYUKI;KAWABATA TAKESHI
分类号 H01L21/60 主分类号 H01L21/60
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