发明名称 |
Compliant interconnect assembly |
摘要 |
An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.
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申请公布号 |
US2005101164(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20040992170 |
申请日期 |
2004.11.18 |
申请人 |
GRYPHICS, INC. |
发明人 |
RATHBURN JAMES J. |
分类号 |
H01L23/48;H01L23/498;H01R12/00;H01R12/16;H01R12/24;H01R13/24;H05K3/32;H05K3/36;(IPC1-7):H01R12/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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