PLASMA TREATMENT METHOD, PLASMA FILM FORMING METHOD, PLASMA ETCHING METHOD AND PLASMA TREATMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a plasma treatment method in which a substrate, a thin film and the like having a large area can be subjected to uniform plasma treatment.

SOLUTION: The plasma treatment method comprises a step of performing plasma treatment on a surface to be plasma-treated in plasma in which particles constituting the plasma caused by a plasma treatment material gas containing molecules to be negative ions in the plasma and gas-like molecules relieving an electric function of the negative ion are mixedly present. Preferably, the gas-like molecules have negative electronic affinities. Further, preferably, a reaction sectional area pertaining to the electronic adhesion of the gas-like molecules is smaller than that pertaining to the electronic adhesion of the plasma treatment material gas.

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