| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology of manufacturing efficiently a package which contains a plurality of semiconductor chips. <P>SOLUTION: A method of manufacturing the semiconductor device first seals the semiconductor chip with resin to form a seal (S10), and performs polishing/thin filming for the seal (S12). Continuously, the operation of the seal (S14) is inspected, and a laminate is formed by laminating with other semiconductor chip or the seal using only a good article (S18). Then, the laminate is sealed with the resin (S20). Thus, the semiconductor device is obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
