| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing method and device of a multilayer printed wiring board capable of filling a through hole and a via hole with resin paste without polluting the surface of a substrate with resin paste by a simple method. SOLUTION: Films 3 are bonded to both face sides of a substrate 100. The through holes/via holes 4 are made and a substrate 102 is obtained. Resin paste 5 is made to flow on the surface of the substrate 102. Squeezing is performed by using a squeegee 6. The through holes/via holes 4 are filled with resin paste 5. Resin paste 5 is dried and preliminarily cured. A film is peeled and resin paste is actually cured. A post-process which is the same as a conventional method such as a surface processing, resist printing and outline machining is performed on a substrate 103, and the wiring board can be completed. COPYRIGHT: (C)2005,JPO&NCIPI |
