SEMICONDUCTOR TESTING DEVICE, PROBE NEEDLE THEREOF, AND PLATE OF SEMICONDUCTOR LASER TESTING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a semiconductor laser chip from adhering to a probe needle or a plate for chip mounting. SOLUTION: The semiconductor laser chip 11 is pinched by the probe needle 15 wherein a plating layer 12 composed of nickel or chromium in which gold is hard to perform self diffusion is formed on the surface of a copper substrate, and a metal block 14 wherein a plating layer 13 composed of nickel or chromium in which gold is hard to perform self diffusion is formed on a surface of the block. In the case of testing to the semiconductor laser chip 11, the adherence of the chip 11 to the probe needle 15 or the metal block 14 caused by the self diffusion of gold is prevented. COPYRIGHT: (C)2005,JPO&NCIPI