METHOD OF DESIGNING POWER SUPPLY INTERCONNECTION

摘要

PROBLEM TO BE SOLVED: To provide a method of designing a power supply interconnection by which the voltage drop of a semiconductor chip can be predicted rapidly and accurately. SOLUTION: The method of designing a power supply interconnection structure for supplying power to a square-shaped semiconductor chip comprises a first step wherein the preparation of a power supply interconnection structure having an x-directional interconnection layer consisting of a plurality of parallel interconnections arranged in the y direction at an interconnection pitch pw, each having a resistance value of Rintper unit length and being extended in the x direction, and a y-directional interconnection layer consisting of a plurality of parallel interconnections arranged in the x direction at the interconnection pitch pw, each having the resistance value of Rintper unit length and being extended in the y direction is assumed; and a second step wherein a supply voltage drop Vdropat the central point of the semiconductor chip is estimated using a formula (1), when supply voltage Vddis applied across each interconnection to supply power to the semiconductor chip. COPYRIGHT: (C)2005,JPO&NCIPI