发明名称 APPARATUS AND METHOD OF FORMING COATING FILM
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a coating film by which the coating film is formed while the film thickness of a coating composition applied on a material to be coated is controlled with high accuracy with a simple apparatus without being affected by a change in atmospheric pressure, and to provide an apparatus for forming the coating film. SOLUTION: A coating process is carried out in a chamber 5 where the atmospheric pressure is controllable. The atmospheric pressure is controlled by allowing a control unit 12 to control a pressure sensor 18, a mass flow controller 14 which is a gas quantity control part, and pumps 15 and 17. The atmospheric pressure in the coating process is controlled to 8×10<SP>4</SP>to 2×10<SP>5</SP>. The rotation of the material to be coated is controlled by a rotation speed control part of the control unit 12 and the coating is carried out under a rotation speed condition corresponding to a prescribed value of the atmospheric pressure. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005118751(A) 申请公布日期 2005.05.12
申请号 JP20030359298 申请日期 2003.10.20
申请人 SEIKO EPSON CORP 发明人 SHINDO AKINORI
分类号 B05D1/40;B05C11/08;B05C11/10;B05D3/00;H01L21/027;(IPC1-7):B05D1/40 主分类号 B05D1/40
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