发明名称 |
Multi-layer printed circuit board and fabricating method thereof |
摘要 |
A fabricating method for a multi-layer printed circuit board comprises the steps of: attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to the releasing film, thereby forming a base member; forming a first connection portion on the first metal film by an electroplating process; forming a connection portion that a second connection portion is integrally formed with the first connection portion on the first connection portion; forming a second metal film on the second connection portion so as to be electrically connected to the connection portion; and etching a specific part of the second metal film and thereby forming copper patterns.
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申请公布号 |
US2005098347(A1) |
申请公布日期 |
2005.05.12 |
申请号 |
US20040981778 |
申请日期 |
2004.11.05 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
HWANG JUNG-HO;LEE SUNG-GUE;LEE SANG-MIN;HAN JOON-WOOK;EO TAE-SIK;YANG YU-SEOCK |
分类号 |
H05K1/11;H05K3/00;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K1/00;H05K3/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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