SPUTTERING TARGET ASSEMBLY HAVING LOW CONDUCTIVITY BACKING PLATE AND METHOD OF MAKING SAME

摘要

A target and backing plate assembly (10) and method of making the same. The backing plate (14) is made of a material having an electrical conductivity less than or equal to 45 % IACS and is selected from the group consisting of Al alloys, Cu alloys, magnesium, magnesium alloys, molybdenum, molybdenum alloys, zinc, zinc alloys, nickel and nickel alloys. The target (12) is bonded to the backing plate (14).