发明名称 Memory embedded semiconductor device and method for fabricating the same
摘要 A memory embedded semiconductor device according to the present invention has a memory region having a memory transistor and a logic region having a logic transistor each provided in a common semiconductor substrate. The logic transistor has a gate electrode provided on the semiconductor substrate and source/drain diffusion layers formed in the semiconductor substrate each having a silicide film formed thereon. On the other hand, the memory transistor has a gate electrode provided on the semiconductor substrate and source/drain diffusion layers formed in the semiconductor substrate each having a silicide film formed thereon to be thinner than the silicide film formed on each of the source/drain diffusion layers of the logic transistor.
申请公布号 US2005101076(A1) 申请公布日期 2005.05.12
申请号 US20040979222 申请日期 2004.11.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKABAYASHI TAKASHI
分类号 H01L21/28;H01L21/8234;H01L21/8239;H01L21/8242;H01L21/8246;H01L27/088;H01L27/10;H01L27/105;H01L27/108;H01L27/112;H01L29/417;(IPC1-7):H01L21/823 主分类号 H01L21/28
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