| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vessel with improved heat resistance, capable of preventing a soldering part from occurrence of crack even on use under an environment of a large temperature difference, capable of preventing exfoliation of a lead wire from a solder and defective conduction between the lead wire and a metal cap. <P>SOLUTION: The vessel is composed of a glass bulb 2 having a concave part 1 at its end part, a metal cap 7 fixed to the end part of the glass bulb so as to cover at least a part of the concave part 1, and a lead wire 10 for power supply connected to the metal cap 7 through a lead-free solder 17 poured between the concave part 1 and the metal cap 7. The lead-free solder 17 contacting the glass bulb 2 and the metal cap 7 at the concave part 1 is composed of Sn as a main component, and 5 to 40 mass% of Sb and not more than 10 mass% of Cu as residual components, of which, a solidus temperature is 235°C or higher. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
