| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in soldering resistance when formed in a non-copper frame and a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) 1-H-1,2,4-triazole-3-thiol expressed by formula (1) as essential components. The semiconductor device is obtained by sealing a semiconductor element by using the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
