| 摘要 |
PROBLEM TO BE SOLVED: To improve insulation and cooling properties of a semiconductor device without increasing a cost. SOLUTION: The semiconductor device has a configuration where the surface of a bus-bar 4 opposite to another surface bonded to a semiconductor chip 1 is bonded to a cooler 10 through an insulating layer 5. The insulating layer 5 is formed on the bus-bar 4 so as to spread over its surface bonded to the cooler 10 extending, at least, from its side. COPYRIGHT: (C)2005,JPO&NCIPI |
