发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE HAVING SILICIDED ELECTRODE
摘要 PROBLEM TO BE SOLVED: To facilitate the formation of two electrodes that have different work functions. SOLUTION: Regarding a manufacturing method for a semiconductor device including a first semiconductor structure having a dielectric layer and a first conductor and a second semiconductor structure having a dielectric layer and a second conductor, in which a part of the first conductor adjacent to the dielectric layer has a semiconductor body, whose work function is different from that of the corresponding part of the second conductor, a metallic layer is applied to the dielectric layer after the dielectric layer is applied to the semiconductor body, and then, a silicon layer is accumulated on this metallic layer, and further, the silicon layer and the metallic layer react to each other at the position of the first semiconductor structure, thus forming a metallic silicide. By etching layers other than the silicon layer, particularly metallic layers in one of the two semiconductor structures, these parts of the conductors having respective different work functions are formed, and in addition, other metallic layers are applied extending across the silicon layer and used to form other metallic silicides at the position of the second transistor. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005123625(A) 申请公布日期 2005.05.12
申请号 JP20040301647 申请日期 2004.10.15
申请人 INTERUNIV MICRO ELECTRONICA CENTRUM VZW;KONINKL PHILIPS ELECTRONICS NV 发明人 SCHRAM TOM;HOOKER JACOB CHRISTOPHER;VAN DAL MARCUS JOHANNES HENRICUS
分类号 H01L21/28;H01L21/8234;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;(IPC1-7):H01L29/423;H01L21/823 主分类号 H01L21/28
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